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Denka Hardloc

Introduction

Hardloc is a two-liquid primary components type modified acrylic structural adhesive developed from DENKA’s original technology. Its impact resistance and room temperature curing properties dramatically boost working efficiency. Due to its superb adhesive properties with metals, ceramics, plastics and many other materials, it can be used for a wide range of design configurations such as in combinations where different materials are used together. The development of new adhesives such as the ultraviolet/heat curing adhesive for chip components and the two liquid primary components type urethane adhesives, both of which are based on the modified acrylic adhesives mentioned above, has made it possible for us to respond to a wider range of needs.

In addition to this, we have prepared support systems for both the “hard” and “soft” aspects of our operations and have developed various application devices so that optimum performance of the adhesives is obtained.

Hardloc Characteristics



Plastics
Kisloy
General Plastic Resin
Chemicals
Epifine Epoxy Resin
Sesame Peptide
Silicone
Denka Hardloc
Sangelose
Electronics
Senju EcoSolder
EcoPeeler
diX
Sponge Roller
Underfill
Adhesive & Masking Tape
   
 
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